DGAP-News: Micron Technology Expands China Manufacturing Operations

Micron Technology, Inc.

19.04.2011 03:00
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XI–AN, China, April 19, 2011 (GLOBE NEWSWIRE) — Micron Technology, Inc.
(Nasdaq:MU), today announced the expansion of its operations in Xi–an, China,
commemorated at a ceremony attended by government, community and company
leaders. The expansion involves the completion of Micron–s second semiconductor
Test and Module Assembly building to complement its existing facility in Xi–an.

–China continues to be key to Micron–s growth efforts. This expansion is the
result of tremendous work by many at Micron, in the Xi–an High Tech Zone and
throughout the government in Midwest China, Shaanxi Province and Xi–an,– said
Steve Appleton, Micron Chairman and CEO.

The completion of the new 400,000 square foot building will better accommodate
Micron Asia customers that now make up the majority of the company–s annual
revenue. The new Test and Module Assembly facility is expected to be
operational and fully built-out in the next three to five years, pending market
conditions.

Micron first began semiconductor test module assembly operations in Xi–an in
2007 with the completion of an 180,000 square foot facility. This operation has
successfully grown to employ more than 1,000 team members with a test capacity
that is Micron–s largest in the world.

Micron–s presence in China began in 2001 with an office in Xiamen. In 2004,
Micron Semiconductor Shanghai opened along with branch offices in Beijing and
Shenzhen to provide corporate, sales and marketing consulting services
throughout China. Micron also chose Shanghai as the location of one of the
company–s integrated circuit design centers and formed Micron Semiconductor
Technology. Micron Semiconductor Technology is a key hub in Micron–s network
for providing support to a variety of Asia-based mobile phone and consumer
electronic device manufacturers.

Micron Technology, Inc., is one of the world–s leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR flash memory, as well as other
innovative memory technologies, packaging solutions and semiconductor systems
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron–s common stock is traded on the NASDAQ under the MU symbol. To
learn more about Micron Technology, Inc., visit www.micron.com.

Media Kit: http://micron.com/about/media/mediakits/china_mfg_ops.html

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All
other trademarks are the property of their respective owners.

The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950

CONTACT: Daniel Francisco
Micron Technology, Inc.
208-368-5584
dfrancisco@micron.com

Charles Xu
Micron Technology China
+8629 6891 6000
xucharles@micron.com
News Source: NASDAQ OMX

19.04.2011 Dissemination of a Corporate News, transmitted by DGAP –
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.

DGAP–s Distribution Services include Regulatory Announcements,
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Media archive at www.dgap-medientreff.de and www.dgap.de

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Language: English
Company: Micron Technology, Inc.

United States
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ISIN: US5951121038
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End of Announcement DGAP News-Service

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