Micron Technology, Inc.
28.06.2011 17:54
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Micron–s Industry-Leading RLDRAM(R) 3 Memory Continues to Be Integrated into
Next-Generation ProductsBOISE, Idaho, June 28, 2011 (GLOBE NEWSWIRE) — To meet the rising global
demand for information from across the Internet, Micron Technology, Inc.
(Nasdaq:MU), today announced that Alcatel-Lucent has chosen Micron–s
third-generation reduced latency DRAM (RLDRAM 3 memory) to drive
Alcatel-Lucent–s next generation of network offerings. A leader in fixed,
mobile and converged broadband networking solutions, Alcatel-Lucent plans to
rely on Micron–s RLDRAM 3 memory to support the industry–s first 400-gigabit
(Gb) capable chipset.
Micron–s third generation of RLDRAM memory was developed to enable a faster,
more efficient transfer of data over the network by doubling performance to
76.8 Gb/s and cutting latency to below 10 nanoseconds. Both improvements help
networking segment customers meet the broadband infrastructure–s rapidly
evolving demands.
–Service providers are starting to combine residential, business and mobile
services onto a single IP network,– said Ken Kutzler, Vice President of
Hardware Development for Alcatel-Lucent–s IP Division. –Micron–s
state-of-the-art memory enables leading IP equipment suppliers like
Alcatel-Lucent to help service providers meet the planet–s voracious appetite
for data.–
Micron and Alcatel-Lucent have collaborated on many fronts for more than a
decade. The integration of RLDRAM memory–from Micron–s definition phase to
early production–into these latest Alcatel-Lucent products has been a three
year journey. Micron is expected to begin production of RLDRAM 3 memory during
the second half of 2011. Information on ordering RLDRAM 3 product samples can
be found on Micron–s Web site.
Relevant Links
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Micron
— Micron Innovations Blog: www.micronblogs.com
— Micron on Twitter: http://twitter.com/microntechnews
— Micron Pressroom: www.micron.com/media
About Micron
Micron Technology, Inc., is one of the world–s leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR flash memory, as well as other
innovative memory technologies, packaging solutions and semiconductor systems
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron–s common stock is traded on the NASDAQ under the MU symbol. To
learn more about Micron Technology, Inc., visit www.micron.com.
The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950
(c)2011 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners.
This press release contains forward-looking statements regarding production of
RLDRAM 3. Actual events or results may differ materially from those contained
in the forward-looking statements. Please refer to the documents Micron files
on a consolidated basis from time to time with the Securities and Exchange
Commission, specifically Micron–s most recent Form 10-K and Form 10-Q. These
documents contain and identify important factors that could cause the actual
results for Micron on a consolidated basis to differ materially from those
contained in our forward-looking statements (see Certain Factors). Although we
believe that the expectations reflected in the forward-looking statements are
reasonable, we cannot guarantee future results, levels of activity, performance
or achievements.
CONTACT: Daniel FranciscoMicron Technology,
Inc.208-368-5584dfrancisco@micron.com
News Source: NASDAQ OMX
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Language: English
Company: Micron Technology, Inc.
United States
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ISIN: US5951121038
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